{"id":1763,"date":"2026-07-31T10:16:32","date_gmt":"2026-07-31T10:16:32","guid":{"rendered":"https:\/\/haktak.com\/?p=1763"},"modified":"2026-07-31T10:16:34","modified_gmt":"2026-07-31T10:16:34","slug":"thermal-paste-application-methods","status":"publish","type":"post","link":"https:\/\/haktak.com\/de\/thermal-paste-application-methods\/","title":{"rendered":"Methoden zum Auftragen von W\u00e4rmeleitpaste: Punkt, Strich, Verstreichen oder Schablone?"},"content":{"rendered":"<div class=\"product\"><div class=\"product\">\n<p class=\"wp-block-paragraph\">Es gibt kein einzelnes W\u00e4rmeleitpasten-Auftragsverfahren, das f\u00fcr jedes Ger\u00e4t am besten geeignet ist. Ein zentraler Punkt l\u00e4sst sich schnell auftragen und funktioniert bei vielen kleinen oder g\u00e4ngigen CPU-W\u00e4rmeverteilern gut. Eine kurze Linie eignet sich f\u00fcr eine l\u00e4ngliche Kontaktfl\u00e4che. Das d\u00fcnne manuelle Verteilen erm\u00f6glicht eine sichtbare Abdeckung von Kante zu Kante und ist daher bei gro\u00dfen W\u00e4rmeverteilern und unbeschichteten Dies hilfreich. Eine Schablone ist sinnvoll, wenn die reproduzierbare Positionierung und Schichtdicke den Einsatz spezieller Werkzeuge rechtfertigen \u2013 in der Regel in der Leistungselektronik oder bei der Serienproduktion.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"596\" src=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/03\/image-1.png\" alt=\"thermal-paste-application-methods\" class=\"wp-image-1407\" srcset=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/03\/image-1.png 1024w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/03\/image-1-300x175.png 300w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/03\/image-1-768x447.png 768w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/03\/image-1-18x10.png 18w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/03\/image-1-600x349.png 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Das beste Verfahren ist dasjenige, das nach der Montage eine d\u00fcnne, durchg\u00e4ngige Schicht \u00fcber der thermisch aktiven Fl\u00e4che hinterl\u00e4sst. Es sollte nur wenige Hohlr\u00e4ume, m\u00f6glichst wenig unsicheren Austritt und gleichbleibende Ergebnisse erzeugen. Die Vorliebe f\u00fcr bestimmte Muster macht Spa\u00df bei Diskussionen im Internet. Die Grenzfl\u00e4che k\u00fcmmert das nicht.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Why the Best Thermal Paste Pattern Changes with the Interface<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Thermal paste, thermal grease, heat sink compound, and CPU paste are common names for the same broad class of thermal interface material. Its job is to fill microscopic valleys between a heat source and a cooler.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Even polished metal is microscopically rough. Two surfaces meet at high points while tiny air pockets remain. Paste displaces that air and improves contact. It should form a thin bond line, not a soft mattress.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The desired heat path is simple:<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">W\u00e4rmequelle -&gt; d\u00fcnne Pastenschicht -&gt; K\u00fchler oder K\u00fchlk\u00f6rper<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">An application method works when it delivers:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>coverage over the active heat area;<\/li>\n\n\n\n<li>a thin final bond line;<\/li>\n\n\n\n<li>low void content;<\/li>\n\n\n\n<li>controlled edge squeeze-out;<\/li>\n\n\n\n<li>repeatable contact under the available mounting pressure.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Choosing a pattern without looking at the package is a bit like choosing a paint roller before measuring the wall. It might work. It might also be the wrong tool entirely.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Pattern Is Only One Variable<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">A perfect-looking X will not fix a warped cooler base. A neat stencil print will not help if clamp pressure is too low. A center dot that works with soft paste may also fail with a stiff compound.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Before choosing a method, check:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>contact-area size and shape;<\/li>\n\n\n\n<li>location of the die or power semiconductor;<\/li>\n\n\n\n<li>paste viscosity, thixotropy, and wetting;<\/li>\n\n\n\n<li>cooler flatness and stiffness;<\/li>\n\n\n\n<li>clamp load and tightening sequence;<\/li>\n\n\n\n<li>electrical conductivity;<\/li>\n\n\n\n<li>Produktionsvolumen und Pr\u00fcfanforderungen.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Die W\u00e4rmeleitf\u00e4higkeit ist wichtig, sagt jedoch nichts dar\u00fcber aus, wie sich eine Paste drucken oder verteilen l\u00e4sst. Der Leitfaden von HAKTAK zu <a href=\"https:\/\/haktak.com\/de\/how-to-choose-and-test-thermal-grease-conductivity\/\">Auswahl und Pr\u00fcfung der W\u00e4rmeleitf\u00e4higkeit von W\u00e4rmeleitpaste<\/a> erl\u00e4utert, warum Pr\u00fcfbedingungen und Einbaugeometrie zusammen mit dem hervorgehobenen W\/mK-Wert betrachtet werden m\u00fcssen. Zuerst wird das Material ausgew\u00e4hlt, anschlie\u00dfend das Auftragsmuster.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Punkt-, Linien-, Fl\u00e4chen- und Schablonenauftrag im \u00dcberblick<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Methode<\/strong><\/td><td><strong>Beste Passform<\/strong><\/td><td><strong>Hauptst\u00e4rke<\/strong><\/td><td><strong>Hauptrisiko<\/strong><\/td><td><strong>Production Repeatability<\/strong><\/td><\/tr><tr><td>Mittelpunkt<\/td><td>Small or mainstream IHS<\/td><td>Fast, clean, and easy to repeat<\/td><td>Incomplete edge coverage<\/td><td>Mittel<\/td><\/tr><tr><td>Kurze Zeile<\/td><td>Elongated package or heat source<\/td><td>Places paste along the long axis<\/td><td>Wrong length or orientation<\/td><td>Mittel<\/td><\/tr><tr><td>Manuelle Ausbreitung<\/td><td>Large IHS or bare die<\/td><td>Visible full coverage<\/td><td>Uneven film or contamination<\/td><td>Gering bis mittel<\/td><\/tr><tr><td>Schablonendruck<\/td><td>Wiederholte Leistungsmodule oder kontrollierte Montage<\/td><td>Definierte Position und Nassschichtdicke<\/td><td>Werkzeug-, Entformungs- und Reinigungsfehler<\/td><td>Nach der Validierung hoch<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">F\u00fcr einen Desktop-CPU reicht oft ein Punkt oder eine Linie. Ein freiliegender GPU-Die profitiert von einer sichtbaren Abdeckung. Tausende Leistungsmodule k\u00f6nnen eine wiederverwendbare Schablone rechtfertigen, um Abfall und Schwankungen zu reduzieren. Nun, die Details sind entscheidend.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Methode mit einem zentralen Punkt f\u00fcr W\u00e4rmeleitpaste: Einfach und schnell<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Bei der Punktmethode wird ein Pastendepot nahe der Mitte des integrierten Heatspreaders bzw. IHS aufgetragen. Wenn der K\u00fchler abgesenkt wird, dr\u00fcckt der Anpressdruck die Paste in einem ann\u00e4hernd kreisf\u00f6rmigen Muster nach au\u00dfen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Sie ist beliebt, weil sie:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>schnell und sauber ist;<\/li>\n\n\n\n<li>leicht zu vermitteln;<\/li>\n\n\n\n<li>ohne Auftragswerkzeug verwendbar;<\/li>\n\n\n\n<li>die Paste kann sich von der Mitte nach au\u00dfen verteilen, wodurch gro\u00dfe eingeschlossene Lufttaschen begrenzt werden.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Wo die Punktmethode am besten funktioniert<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Ein Punkt in der Mitte ist eine praktische Ausgangsmethode f\u00fcr ein kleines oder g\u00e4ngiges quadratisches IHS. Sie funktioniert am besten, wenn die Paste leicht flie\u00dft und der K\u00fchler gleichm\u00e4\u00dfigen Druck auf eine relativ ebene Kontaktfl\u00e4che aus\u00fcbt.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">F\u00fcr Servicearbeiten ist dies praktisch, da sich der Materialauftrag positionieren l\u00e4sst, ohne die Oberfl\u00e4che zu ber\u00fchren. Weniger Kontakt bedeutet weniger Staub, Flusen und Fingerfett.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">H\u00e4ufige Fehler bei der Punktmethode<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Die Punktmethode setzt voraus, dass sich die Paste weit genug verteilt. Dabei k\u00f6nnen trockene Ecken zur\u00fcckbleiben, wenn:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>der Materialauftrag zu klein ist;<\/li>\n\n\n\n<li>die Paste eine hohe Viskosit\u00e4t oder Flie\u00dfgrenze aufweist;<\/li>\n\n\n\n<li>der IHS ist gro\u00df oder l\u00e4nglich;<\/li>\n\n\n\n<li>der K\u00fchler wird schr\u00e4g abgesenkt;<\/li>\n\n\n\n<li>die Kaltplatte \u00fcbt keinen gleichm\u00e4\u00dfigen Druck aus;<\/li>\n\n\n\n<li>der Materialauftrag beginnt au\u00dfermittig.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Versuchen Sie nicht, jede trockene Ecke mit einem riesigen Punkt zu beheben. Das Material kann einfach an der n\u00e4chstgelegenen Kante austreten. Mehrere Punkte, eine Linie oder eine fl\u00e4chige Verteilung k\u00f6nnen dieselbe Menge zweckm\u00e4\u00dfiger verteilen.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">W\u00e4rmeleitpaste nach der Linienmethode f\u00fcr l\u00e4ngliche W\u00e4rmequellen<\/h2>\n\n\n\n<figure class=\"wp-block-image size-full\"><img decoding=\"async\" width=\"1010\" height=\"672\" src=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/06\/image-5.png\" alt=\"W\u00e4rmeleitpaste nach der Linienmethode f\u00fcr l\u00e4ngliche W\u00e4rmequellen\" class=\"wp-image-1542\" srcset=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/06\/image-5.png 1010w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/06\/image-5-300x200.png 300w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/06\/image-5-768x511.png 768w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/06\/image-5-18x12.png 18w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/06\/image-5-600x399.png 600w\" sizes=\"(max-width: 1010px) 100vw, 1010px\" \/><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Bei der Linienmethode wird eine schmale Raupe entlang der L\u00e4ngsachse aufgetragen. Dadurch verk\u00fcrzt sich der Weg, den die Paste zu den Enden eines rechteckigen IHS zur\u00fccklegen muss.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Dadurch eignet sie sich f\u00fcr:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>l\u00e4ngliche CPU-Geh\u00e4use f\u00fcr Desktop-Anwendungen;<\/li>\n\n\n\n<li>\u00e4ltere Prozessoren des Typs HEDT;<\/li>\n\n\n\n<li>einige gro\u00dffl\u00e4chige Leistungshalbleiter-Footprints;<\/li>\n\n\n\n<li>Schnittstellen, bei denen der Die l\u00e4ngs unter dem Deckel verl\u00e4uft.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Warum die Linienausrichtung wichtig ist<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Die Linie sollte zum Geh\u00e4use und zum voraussichtlichen W\u00e4rmeweg passen. Die vertikale Ausrichtung ist nicht automatisch besser als die horizontale. Die Ausrichtung h\u00e4ngt von der IHS, der Lage des Dies, der Aufstandsfl\u00e4che des K\u00fchlers und den Vorgaben des Lieferanten ab.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Die Raupe sollte schmal bleiben. Eine dicke, wurstf\u00f6rmige Raupe kann an beiden Enden zu stark herausgequetscht werden. Eine Raupe, die zu fr\u00fch endet, kann dazu f\u00fchren, dass die Randbereiche trocken bleiben. Ja, ein gewisses Ma\u00df an Beurteilung ist nach wie vor erforderlich.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Wenn eine Linie nicht ausreicht<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Gro\u00dfe Prozessoren mit mehreren Dies und Leistungsmodule ben\u00f6tigen m\u00f6glicherweise mehrere kurze Linien, mehrere Punkte oder eine vollfl\u00e4chige Verteilung. Ein einzelner Strang in der Mitte kann den hei\u00dfesten Bereich abdecken, aber weiter entfernt liegende Siliziumbereiche verfehlen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Befolgen Sie bei einem mitgelieferten CPU K\u00fchler oder einer mitgelieferten W\u00e4rmeleitpaste das daf\u00fcr angegebene Auftragsschema. Hersteller wie Noctua, Corsair, Intel und AMD empfehlen m\u00f6glicherweise unterschiedliche Anordnungen, da sich ihre Geh\u00e4use, Pasten und Montagevoraussetzungen unterscheiden. Das ist nicht zwangsl\u00e4ufig ein Widerspruch.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">W\u00e4rmeleitpaste manuell verteilen f\u00fcr sichtbare Abdeckung<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Beim manuellen Verstreichen wird vor der Montage eine d\u00fcnne Schicht \u00fcber die Kontaktfl\u00e4che verteilt. Der wichtigste Vorteil ist die sichtbare Abdeckung, sodass weniger Unsicherheit hinsichtlich entfernter Ecken besteht.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Manuelles Auftragen eignet sich f\u00fcr:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>gro\u00dfe CPU W\u00e4rmeverteiler;<\/li>\n\n\n\n<li>Threadripper- und andere HEDT Packages;<\/li>\n\n\n\n<li>CPU oder GPU ungeh\u00e4uste Dies;<\/li>\n\n\n\n<li>thermisches Benchmarking, bei dem eine visuell reproduzierbare Schicht erforderlich ist;<\/li>\n\n\n\n<li>Montage von Leistungselektronik in kleinen St\u00fcckzahlen.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">F\u00fchrt das Verteilen von W\u00e4rmeleitpaste zu Lufteinschl\u00fcssen?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Das kann passieren, aber das Risiko wird oft zu stark vereinfacht dargestellt.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Eine raue, geriffelte Schicht kann Hohlr\u00e4ume erzeugen. Staub oder Fasern k\u00f6nnen dasselbe bewirken. Eine saubere, d\u00fcnne Verteilung kann gut funktionieren, w\u00e4hrend der abschlie\u00dfende Anpressdruck sie in die Unebenheiten der Oberfl\u00e4che dr\u00fcckt.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Die eigentlichen Fehler sind meist ganz allt\u00e4glich:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>using a dirty card;<\/li>\n\n\n\n<li>touching the paste with a bare finger;<\/li>\n\n\n\n<li>leaving thick ridges;<\/li>\n\n\n\n<li>scraping some regions nearly dry;<\/li>\n\n\n\n<li>taking so long that contamination lands on the surface;<\/li>\n\n\n\n<li>sliding the cooler around after contact.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">For cleaning, preparation, and cooler installation, use the complete HAKTAK <a href=\"https:\/\/haktak.com\/de\/tips-applying-thermal-grease-how-it-works\/\">W\u00e4rmeleitpasten-Auftragsworkflow<\/a>. This comparison focuses on choosing the deposition method rather than repeating the entire installation process.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Manual Spread on a Bare Die<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">A bare laptop CPU or GPU has no metal IHS. Uncovered corners matter more, and nearby components may be exposed. A very thin complete spread is often most controllable when service instructions specify paste. Use little force and keep it on the die. Conductive paste makes a slip expensive.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">What Is a Thermal Paste Stencil?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The word &#8220;stencil&#8221; describes two related but different tools.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Consumer CPU Stencil<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">A consumer stencil is usually a frame or mask placed over the IHS. Paste is spread across the opening, and the stencil is lifted away. It helps define the coated area and can make a full spread less messy.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">It does not guarantee the final bond line. The layer changes as the stencil lifts and the cooler compresses it. Stencil thickness, paste viscosity, scraping angle, and technique still matter.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">For one or two CPU installations, a stencil is mostly a convenience tool. It is not mandatory.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Industrial Stencil or Screen Printing<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Industrial stencil printing is a controlled deposition process. It is common where the same baseplate, module, or heat sink is assembled repeatedly.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The process may define:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>aperture shape and location;<\/li>\n\n\n\n<li>stencil material and thickness;<\/li>\n\n\n\n<li>squeegee angle, pressure, and speed;<\/li>\n\n\n\n<li>paste conditioning and rheology;<\/li>\n\n\n\n<li>alignment fixtures;<\/li>\n\n\n\n<li>separation speed;<\/li>\n\n\n\n<li>cleaning interval;<\/li>\n\n\n\n<li>deposit inspection;<\/li>\n\n\n\n<li>revision and lot traceability.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">A power module may operate for years in an inverter, motor drive, or charging system. A pretty print on one sample is not enough.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">How Stencil Thickness and Apertures Control Thermal Grease<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The theoretical wet deposit volume can be estimated as:<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>deposit volume = total open aperture area x stencil thickness<\/strong><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Actual transfer can be lower or uneven. Paste may remain on aperture walls, smear during release, or collect as the stencil becomes dirty.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Designing Apertures Around the Active Area<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">A stencil does not always need one full rectangular opening. A matrix of smaller apertures can place grease over thermally active regions while leaving mounting holes, screws, and edges clear.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Littelfuse&#8217;s application note on <a href=\"https:\/\/www.littelfuse.com\/assetdocs\/basics-of-stencil-generation-to-apply-thermal-grease-to-power-semiconductors?assetguid=773c2d9a-b33f-4a2d-804c-348e6e1bdda3\" target=\"_blank\" rel=\"noopener\">stencil generation for power-semiconductor thermal grease<\/a> shows a practical approach: map the active area, overlay a regular pattern, remove unnecessary deposits, and keep corner screw positions clear.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Paste moves after clamping, so the pattern should anticipate it. Printing to the edge may simply create later squeeze-out.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Common Thermal Paste Stencil Defects<\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Defect<\/strong><\/td><td><strong>Wahrscheinliche Ursache<\/strong><\/td><td><strong>Corrective Direction<\/strong><\/td><\/tr><tr><td>Incomplete aperture release<\/td><td>Paste too stiff, poor aperture geometry, or dirty stencil<\/td><td>Adjust material, aperture, separation, or cleaning<\/td><\/tr><tr><td>Smearing<\/td><td>Excess squeegee pressure, poor alignment, or slow release<\/td><td>Tune print and separation settings<\/td><\/tr><tr><td>Uneven film<\/td><td>Warped part, damaged stencil, or weak fixture support<\/td><td>Improve tooling and flatness control<\/td><\/tr><tr><td>Blocked openings<\/td><td>Filler buildup or long cleaning interval<\/td><td>Define inspection and cleaning frequency<\/td><\/tr><tr><td>Excess edge squeeze-out<\/td><td>Too much print volume or clamp load<\/td><td>Reduce aperture area or stencil thickness<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Stencil printing is not automatically better than dispensing. It becomes better when a stable process produces lower variation, less waste, and easier inspection for the real assembly.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Which Thermal Paste Method Performs Best in Testing?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Comparative tests often find small temperature differences among methods that provide enough coverage. Bad coverage is the larger problem.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">In einem <a href=\"https:\/\/www.pugetsystems.com\/labs\/articles\/thermal-paste-application-techniques-170\/\" target=\"_blank\" rel=\"noopener\">Puget Systems application-technique test<\/a>, the X pattern produced the best spread and the lowest reported full-load temperature in that setup. A smooth spread and rice-sized dot were close. Some over-applied patterns performed worse.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The lesson is not &#8220;always draw an X.&#8221; The test used one processor generation, cooler, paste, workload, and procedure. A single setup cannot describe every interface.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Why Benchmarks Disagree<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Results shift with:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>die location beneath the IHS;<\/li>\n\n\n\n<li>package size and shape;<\/li>\n\n\n\n<li>paste formulation and amount;<\/li>\n\n\n\n<li>cooler pressure and flatness;<\/li>\n\n\n\n<li>mounting sequence;<\/li>\n\n\n\n<li>CPU-Paketleistung;<\/li>\n\n\n\n<li>Umgebungstemperatur;<\/li>\n\n\n\n<li>Sensoraufl\u00f6sung;<\/li>\n\n\n\n<li>Schwankungen von Montage zu Montage.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Wenn drei gute Methoden innerhalb weniger Zehntelgrad liegen, kann das eher eine normale Pr\u00fcfstreuung als ein aussagekr\u00e4ftiger Vorsprung sein.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Ein besserer Validierungsplan<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">For an engineering comparison, repeat several mounts. Record deposit amount, power, ambient temperature, cooling settings, and steady-state temperature rise. Remember that lifting the cooler changes the paste imprint.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Production validation should also measure unit-to-unit variation. The best average result is not very useful if the process occasionally produces a terrible print.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Thermal Paste Method by Application<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Anwendung<\/strong><\/td><td><strong>Preferred Starting Method<\/strong><\/td><td><strong>Warum<\/strong><\/td><\/tr><tr><td>Mainstream desktop CPU<\/td><td>Dot, short line, or supplier pattern<\/td><td>Fast and normally adequate under firm clamp pressure<\/td><\/tr><tr><td>Elongated desktop IHS<\/td><td>Line or multi-dot pattern<\/td><td>Better distribution along the package<\/td><\/tr><tr><td>Threadripper or large HEDT<\/td><td>Multi-line, multi-dot, or thin spread<\/td><td>Larger active area and multi-die layout<\/td><\/tr><tr><td>Laptop CPU or GPU bare die<\/td><td>Thin complete spread<\/td><td>Reduces the chance of uncovered silicon corners<\/td><\/tr><tr><td>Electronics repair shop<\/td><td>Defined manual pattern plus test record<\/td><td>Repeatability without dedicated tooling<\/td><\/tr><tr><td>IGBT or SiC power module<\/td><td>Qualified stencil, screen print, or controlled dispense<\/td><td>Placement, volume, and traceability matter<\/td><\/tr><tr><td>LED or industrial module<\/td><td>Spread, stencil, or dispense path<\/td><td>Depends on substrate geometry and production volume<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\">Intel and AMD CPU Patterns<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">The logo on the processor does not decide the method by itself. Recent Intel packages can be long, while AMD AM5 has a different IHS shape and edge geometry. Large AMD Threadripper packages are another category again.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Use package dimensions, heat-source layout, paste behavior, and cooler instructions. A method that fits an older square CPU may not cover an elongated or multi-die package as reliably.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Power Modules, EV Inverters, and Industrial Drives<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Power modules raise the stakes. Contact areas are large, torque is controlled, and service life may include thousands of thermal cycles. Stencil printing or automated dispensing can win because the process is measurable and traceable.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The real comparison becomes cost versus control. Tooling takes time and money. At sufficient volume, reduced variation and faster application usually pay it back.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">How Paste Material Changes the Best Method<\/h2>\n\n\n\n<figure class=\"wp-block-image size-full\"><img decoding=\"async\" width=\"1006\" height=\"664\" src=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/02\/image-15.png\" alt=\"How Paste Material Changes the Best Method\" class=\"wp-image-1354\" srcset=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/02\/image-15.png 1006w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/02\/image-15-300x198.png 300w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/02\/image-15-768x507.png 768w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/02\/image-15-600x396.png 600w\" sizes=\"(max-width: 1006px) 100vw, 1006px\" \/><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">A paste must move under the available force. Low-viscosity grease may spread far from one deposit. A highly filled, stiff formulation may need distributed dots, lines, or direct spreading.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Thixotropic materials add another wrinkle. Their apparent viscosity falls under shear, so behavior beneath a squeegee can differ from behavior while resting on a module. Filler size and shape can also affect stencil release.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Wann <a href=\"https:\/\/haktak.com\/de\/choose-best-thermal-paste-for-cpu\/\">Auswahl der W\u00e4rmeleitpaste f\u00fcr eine CPU<\/a>, consider electrical safety, stability, viscosity, and mounting conditions alongside conductivity.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Color Does Not Choose the Method<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Wei\u00dfe Compounds verwenden h\u00e4ufig keramische F\u00fcllstoffe. Graue Produkte k\u00f6nnen Kohlenstoff, Metalloxide oder andere Mischungen enthalten. Dennoch ist die Farbe kein verl\u00e4sslicher Hinweis auf W\u00e4rmeleitf\u00e4higkeit, Viskosit\u00e4t oder elektrisches Verhalten. Der Vergleich von HAKTAK <a href=\"https:\/\/haktak.com\/de\/thermal-grease-white-vs-gray-difference\/\">white and gray thermal grease<\/a> explains why formulation data should lead the decision.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Liquid Metal Needs a Separate Process<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Fl\u00fcssigmetall ist elektrisch leitf\u00e4hig und kann mit Aluminium reagieren. Es sollte normalerweise gem\u00e4\u00df den Anweisungen des Lieferanten als extrem d\u00fcnner, kontrollierter Film aufgetragen werden. Ein gro\u00dfer Punkt, gefolgt von Druck bei niedrigerer Temperatur, ist kein sicherer Ersatz f\u00fcr diesen Prozess.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">When Paste Is the Wrong TIM<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Paste is designed for thin interfaces between nearly mating surfaces. It should not bridge a large mechanical gap or compensate for major height variation.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Where the interface is uneven, compare <a href=\"https:\/\/haktak.com\/de\/thermal-putty-vs-thermal-paste\/\">W\u00e4rmeleitkitt und W\u00e4rmeleitpaste<\/a>. Where a clean, preformed gap pad is more suitable, measure the actual assembly before <a href=\"https:\/\/haktak.com\/de\/how-to-select-thermal-pad-thickness-for-electronics\/\">Auswahl der Dicke des W\u00e4rmeleitpads<\/a>. Changing the pattern cannot fix the wrong TIM format.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Thermal Paste Application Problems and Fixes<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Beobachtetes Problem<\/strong><\/td><td><strong>M\u00f6gliche Ursache<\/strong><\/td><td><strong>Practical Fix<\/strong><\/td><\/tr><tr><td>Dry corner<\/td><td>Deposit too small or cooler tilted<\/td><td>Redistribute the pattern and lower the cooler evenly<\/td><\/tr><tr><td>Central bare spot<\/td><td>Air trapped by a complex pattern or rough spread<\/td><td>Simplify the pattern and improve mounting motion<\/td><\/tr><tr><td>Heavy squeeze-out<\/td><td>Excess deposit or stencil volume<\/td><td>Reduce volume while preserving active-area coverage<\/td><\/tr><tr><td>Uneven imprint<\/td><td>Warped surfaces or uneven torque<\/td><td>Check flatness, mounting hardware, and sequence<\/td><\/tr><tr><td>High temperature with good coverage<\/td><td>Cooler, airflow, power, or material problem<\/td><td>Diagnose the complete thermal path<\/td><\/tr><tr><td>Stencil skips<\/td><td>Poor release or dirty apertures<\/td><td>Tune rheology, aperture design, and cleaning<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Do not judge success from appearance alone. A full, glossy paste layer can still be too thick. A small uncovered IHS edge may be harmless if no active silicon lies beneath it. Context again. It keeps showing up.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Standards and Qualification for Thermal Paste Application<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\"><a href=\"https:\/\/store.astm.org\/d5470-17r24.html\" target=\"_blank\" rel=\"noopener\">ASTM D5470-17(2024)<\/a> covers steady-state thermal impedance and apparent thermal conductivity measurements for thermal interface materials, including greases and pastes. It is useful for comparing material behavior under controlled conditions. It does not name a universal application pattern.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">JEDEC JESD51 methods provide context for semiconductor package thermal characterization. IEC 60068-2-14 can support temperature-change testing. Neither standard, by itself, qualifies a dot, line, spread, or stencil process for a finished product.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">For production, the most important document is often the validated work instruction. It should define:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>material, lot, and conditioning;<\/li>\n\n\n\n<li>deposit amount and coordinates;<\/li>\n\n\n\n<li>stencil revision and thickness;<\/li>\n\n\n\n<li>squeegee and separation settings;<\/li>\n\n\n\n<li>cleaning and inspection intervals;<\/li>\n\n\n\n<li>mounting torque and sequence;<\/li>\n\n\n\n<li>thermal acceptance limits;<\/li>\n\n\n\n<li>post-aging inspection where required.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Reliability testing may include thermal cycling, vibration, power cycling, storage aging, and teardown inspection. Watch for pump-out, dry-out, migration, void growth, and rising thermal resistance.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Practical Thermal Paste Method Checklist<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Before choosing a method, ask:<\/p>\n\n\n\n<ol start=\"1\" class=\"wp-block-list\">\n<li>Is the interface an IHS, bare die, or power-module baseplate?<\/li>\n\n\n\n<li>Where is the thermally active area?<\/li>\n\n\n\n<li>How large and elongated is the contact surface?<\/li>\n\n\n\n<li>How easily does the paste move under the available clamp pressure?<\/li>\n\n\n\n<li>Ist die Verbindung elektrisch leitf\u00e4hig?<\/li>\n\n\n\n<li>Must coverage be visible before mounting?<\/li>\n\n\n\n<li>How many assemblies will be produced?<\/li>\n\n\n\n<li>Is stencil tooling economically justified?<\/li>\n\n\n\n<li>K\u00f6nnen Auftragsmenge und Anpresskraft kontrolliert werden?<\/li>\n\n\n\n<li>Wie werden Abdeckung, Temperatur, Schwankungen und Alterung validiert?<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\">Fazit<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Punkt-, Linien-, Fl\u00e4chenauftrags- und Schablonenverfahren k\u00f6nnen alle eine gute thermische Schnittstelle herstellen. Kein Verfahren ist \u00fcberall \u00fcberlegen.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Verwenden Sie einen zentralen Punkt, wenn die Kontaktfl\u00e4che klein genug ist und der Montagedruck das Material zuverl\u00e4ssig verteilen kann. Verwenden Sie eine Linie, wenn die W\u00e4rmequelle l\u00e4nglich ist. Verteilen Sie das Material manuell in einer d\u00fcnnen Schicht, wenn eine vollst\u00e4ndige visuelle Abdeckung wichtig ist, insbesondere bei gro\u00dfen W\u00e4rmeverteilern und ungekapselten Dies. Verwenden Sie eine Schablone, wenn die wiederholte Produktion eine kontrollierte Platzierung, Nassschichtdicke, Geschwindigkeit und R\u00fcckverfolgbarkeit erfordert.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Das Auftragsmuster ist nur der Anfang. Die Rheologie der Paste, die Materialmenge, die Ebenheit der Oberfl\u00e4chen, die Klemmkraft und die Montage des K\u00fchlers bestimmen die endg\u00fcltige Schichtdicke. In der Produktion sind Wiederholbarkeit und die Leistung unter ung\u00fcnstigsten Bedingungen wichtiger als ein einzelnes hervorragendes Muster.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">W\u00e4hlen Sie also die Methode, die zur Schnittstelle passt. Testen Sie anschlie\u00dfend das montierte System. Der CPU oder das Leistungsmodul entscheidet letztlich \u2013 nicht die darauf aufgetragene Form.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">H\u00e4ufig gestellte Fragen<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Welche Methode zum Auftragen von W\u00e4rmeleitpaste ist die beste?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Es gibt keine universell beste Methode. Ein Punkt eignet sich f\u00fcr viele kleine oder g\u00e4ngige W\u00e4rmeverteiler, eine Linie f\u00fcr l\u00e4ngliche Geh\u00e4use, manuelles Verteilen erm\u00f6glicht eine sichtbare Abdeckung und eine Schablone eignet sich f\u00fcr eine wiederholbare Produktion. W\u00e4hlen Sie die Methode nach Geometrie, Materialverhalten, Druck und Produktionsvolumen aus.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Ist die Punkt- oder die Linienmethode f\u00fcr W\u00e4rmeleitpaste besser?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">A dot is usually simpler on a small square IHS. A line can distribute paste more reliably along a long package. The paste and cooler manufacturer&#8217;s instructions should take priority over a generic rule.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Sollte W\u00e4rmeleitpaste manuell verteilt werden?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Das manuelle Verteilen ist sinnvoll, wenn eine vollst\u00e4ndige sichtbare Abdeckung wichtig ist, etwa bei einem gro\u00dfen IHS oder einem freiliegenden Chip. Verwenden Sie ein sauberes Werkzeug und tragen Sie eine d\u00fcnne, gleichm\u00e4\u00dfige Schicht auf. Verteilen Sie die Paste nicht manuell, wenn die Produktanweisungen ausdr\u00fccklich das Verteilen durch Druck empfehlen.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Entstehen beim Verteilen von W\u00e4rmeleitpaste Luftblasen?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">It can if the layer has deep ridges, contamination, or uneven thickness. A clean, thin spread can work well. Cooler placement and final clamp pressure also affect void formation.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">What Is a Thermal Paste Stencil?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">A stencil is a mask that controls where paste is deposited. Consumer versions help users spread a CPU layer. Industrial stencils use engineered apertures and controlled printing settings to improve placement and repeatability.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">When Is Stencil Printing Better Than Manual Application?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Stencil printing is useful when many identical parts require controlled deposit volume, location, speed, and traceability. It only becomes reliable after aperture design, paste release, alignment, cleaning, and mounting are validated.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Do Intel and AMD CPUs Need Different Paste Patterns?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Sometimes, but not because of the brand alone. Package shape, IHS size, die layout, paste viscosity, and cooler pressure matter. Follow the instructions for the exact CPU platform, paste, and cooler.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Which Method Is Best for a GPU or Bare Die?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">A very thin complete spread is often the safest starting approach because uncovered silicon corners can create hot spots. Use the service instructions, keep conductive paste away from nearby components, and apply even mounting pressure.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Does the Application Pattern Affect CPU Temperature?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Poor coverage can raise temperature. When several methods all provide enough coverage and a thin bond line, measured differences are often small and may approach normal mount-to-mount variation.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">How Can You Check Whether Thermal Paste Coverage Is Correct?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Run a repeatable workload while recording ambient temperature, component power, clock speed, and package or junction temperature. If results are abnormal, inspect the paste imprint and mounting hardware, then clean and apply fresh paste before reassembly.<\/p>\n<\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>There is no single best thermal paste application method for every device. A center dot is quick and works well [&hellip;]<\/p>\n","protected":false},"author":4,"featured_media":1407,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"disabled","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[1],"tags":[],"class_list":["post-1763","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-haktak-blog"],"_links":{"self":[{"href":"https:\/\/haktak.com\/de\/wp-json\/wp\/v2\/posts\/1763","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/haktak.com\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/haktak.com\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/haktak.com\/de\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/haktak.com\/de\/wp-json\/wp\/v2\/comments?post=1763"}],"version-history":[{"count":1,"href":"https:\/\/haktak.com\/de\/wp-json\/wp\/v2\/posts\/1763\/revisions"}],"predecessor-version":[{"id":1764,"href":"https:\/\/haktak.com\/de\/wp-json\/wp\/v2\/posts\/1763\/revisions\/1764"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/haktak.com\/de\/wp-json\/wp\/v2\/media\/1407"}],"wp:attachment":[{"href":"https:\/\/haktak.com\/de\/wp-json\/wp\/v2\/media?parent=1763"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/haktak.com\/de\/wp-json\/wp\/v2\/categories?post=1763"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/haktak.com\/de\/wp-json\/wp\/v2\/tags?post=1763"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}