{"id":2202,"date":"2026-09-15T02:27:52","date_gmt":"2026-09-15T02:27:52","guid":{"rendered":"https:\/\/haktak.com\/?p=2202"},"modified":"2026-09-15T02:27:54","modified_gmt":"2026-09-15T02:27:54","slug":"avoid-voids-thermal-putty","status":"publish","type":"post","link":"https:\/\/haktak.com\/fr\/avoid-voids-thermal-putty\/","title":{"rendered":"Comment \u00e9viter les vides lors de l'utilisation de mastic thermique"},"content":{"rendered":"<div class=\"product\"><div class=\"product\">\n<p class=\"wp-block-paragraph\">L'application de p\u00e2te thermique ressemble un peu \u00e0 la pr\u00e9paration d'une valise. Si l'air n'a nulle part o\u00f9 aller, appuyer plus fort sur le couvercle risque seulement de faire un plus gros d\u00e9sordre sur les bords. Un gros d\u00e9p\u00f4t entre un composant et un dissipateur thermique peut tout de m\u00eame laisser une poche centrale, rater un composant bas ou p\u00e9n\u00e9trer dans une zone interdite. Le v\u00e9ritable objectif est un contact contr\u00f4l\u00e9, de sorte que la pr\u00e9vention des vides commence avant que la buse ne bouge et se poursuit apr\u00e8s le serrage des vis.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"900\" height=\"506\" src=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-62.png\" alt=\"comment \u00e9viter les vides dans le mastic thermique\" class=\"wp-image-2204\" srcset=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-62.png 900w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-62-300x169.png 300w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-62-18x10.png 18w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-62-767x431.png 767w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-62-599x337.png 599w\" sizes=\"(max-width: 900px) 100vw, 900px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Qu'est-ce qui compte comme un vide dans une interface de p\u00e2te thermique ?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Un vide est une zone o\u00f9 le mat\u00e9riau d'interface thermique n'\u00e9tablit pas le contact pr\u00e9vu. Cette d\u00e9finition semble simple, mais plusieurs d\u00e9fauts diff\u00e9rents sont qualifi\u00e9s de \u201c vides \u201d sur la cha\u00eene de production.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>A <strong>macro vide<\/strong> est une poche d'air visible \u00e0 l'int\u00e9rieur du d\u00e9p\u00f4t comprim\u00e9.<\/li>\n\n\n\n<li>A <strong>micor-espace<\/strong> provient de la rugosit\u00e9 de surface, de la contamination ou d'un mouillage insuffisant.<\/li>\n\n\n\n<li>A <strong>zone ignor\u00e9e<\/strong> est un endroit qui n'a jamais re\u00e7u assez de mat\u00e9riel.<\/li>\n\n\n\n<li><strong>Bord<\/strong> <strong>famine<\/strong> se produit lorsque de la mati\u00e8re est \u00e9tir\u00e9e ou comprim\u00e9e loin d'une limite.<\/li>\n\n\n\n<li>A <strong>bulle de gu\u00e9rison<\/strong> se forme lorsque de l'air ou des substances volatiles se dilatent \u00e0 l'int\u00e9rieur d'un mastic bicomposant en cours de durcissement.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Ces d\u00e9fauts n'ont pas une cause unique. Un vide central sugg\u00e8re de l'air emprisonn\u00e9 lors de la fermeture. Des retassures de durcissement al\u00e9atoires pointent vers le m\u00e9lange, l'approvisionnement ou le d\u00e9givrage. Un seul bo\u00eetier VRAM bas sans marque de transfert sugg\u00e8re une tol\u00e9rance ou un placement. L'emplacement compte \u00e9galement : un petit vide au-dessus d'un point chaud de MOSFET peut importer plus qu'un plus grand au-dessus d'un coin frais. \u00c9valuer <a href=\"https:\/\/haktak.com\/fr\/thermal-conductivity-vs-thermal-impedance-tim-selection\/\">conductivit\u00e9 thermique en fonction de l&#x27;imp\u00e9dance thermique<\/a> au niveau de l'interface assembl\u00e9e, et non par un seul num\u00e9ro de mati\u00e8re.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img decoding=\"async\" width=\"900\" height=\"506\" src=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-63.png\" alt=\"comment \u00e9viter les vides dans le mastic thermique\" class=\"wp-image-2205\" srcset=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-63.png 900w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-63-18x10.png 18w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-63-300x169.png 300w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-63-599x337.png 599w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-63-767x431.png 767w\" sizes=\"(max-width: 900px) 100vw, 900px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Pourquoi des vides se forment dans le mastic thermique \u00e0 cinq \u00e9tapes diff\u00e9rentes<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Plusieurs petites variations s'accumulent souvent : un mat\u00e9riau froid, un bourrelet \u00e9troit et un dissipateur thermique l\u00e9g\u00e8rement inclin\u00e9e. Chacune semble inoffensive isol\u00e9e. Ensemble, eh bien, voil\u00e0 votre vide.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td class=\"has-text-align-left\" data-align=\"left\">Stage de formation<\/td><td class=\"has-text-align-left\" data-align=\"left\">Preuve type<\/td><td class=\"has-text-align-left\" data-align=\"left\">Cause probable<\/td><td class=\"has-text-align-left\" data-align=\"left\">Premi\u00e8re v\u00e9rification<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">\u00c9tat mat\u00e9riel<\/td><td class=\"has-text-align-left\" data-align=\"left\">\u00c9coulement difficile, s\u00e9paration, \u00e9talement irr\u00e9gulier<\/td><td class=\"has-text-align-left\" data-align=\"left\">Mauvais stockage, conditionnement insuffisant, \u00e2ge, contamination<\/td><td class=\"has-text-align-left\" data-align=\"left\">Num\u00e9ro de lot, dur\u00e9e de conservation, enregistrement du stockage, temp\u00e9rature de la mati\u00e8re<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Syst\u00e8me d'approvisionnement<\/td><td class=\"has-text-align-left\" data-align=\"left\">Bulles al\u00e9atoires ou modification de la taille des perles<\/td><td class=\"has-text-align-left\" data-align=\"left\">Air lors du changement de cartouche ou de seau, pression d'alimentation instable, raccord qui fuit<\/td><td class=\"has-text-align-left\" data-align=\"left\">R\u00e9sultat de la purge, tendance de la pression, \u00e9tat du tuyau et du joint<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Dosage ou m\u00e9lange<\/td><td class=\"has-text-align-left\" data-align=\"left\">Corriger les retassures, les zones molles, la d\u00e9rive du rapport<\/td><td class=\"has-text-align-left\" data-align=\"left\">Pompe us\u00e9e, m\u00e9langeur statique endommag\u00e9, mauvais rapport A\/B, dur\u00e9e de vie en pot d\u00e9pass\u00e9e<\/td><td class=\"has-text-align-left\" data-align=\"left\">Contr\u00f4le du ratio, \u00e9tat du m\u00e9langeur, \u00e9chantillon de durcissement<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">D\u00e9p\u00f4t<\/td><td class=\"has-text-align-left\" data-align=\"left\">\u00c9cart central, coin saut\u00e9, bourrelet cass\u00e9<\/td><td class=\"has-text-align-left\" data-align=\"left\">Mauvais motif ou volume, distance excessive, d\u00e9faut de d\u00e9marrage-arr\u00eat<\/td><td class=\"has-text-align-left\" data-align=\"left\">Largeur du cordon, hauteur, emplacement, continuit\u00e9<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Cl\u00f4ture de l'assembl\u00e9e<\/td><td class=\"has-text-align-left\" data-align=\"left\">Vide r\u00e9p\u00e9titif d'un c\u00f4t\u00e9, mauvais transfert<\/td><td class=\"has-text-align-left\" data-align=\"left\">Basculement, coulissement lat\u00e9ral, fermeture rapide, s\u00e9quence de serrage, but\u00e9es rigides<\/td><td class=\"has-text-align-left\" data-align=\"left\">Chemin de fermeture, parall\u00e9lisme, s\u00e9quence de serrage, jeu final<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\">L'\u00e9tat des mat\u00e9riaux modifie la circulation de l'air<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">La plupart <a href=\"https:\/\/haktak.com\/fr\/liquid-gap-filler\/thermal-putty\/\">p\u00e2te thermique pour l'\u00e9lectronique<\/a> est fortement charg\u00e9 et garde sa forme. Il peut s'agir d'un compos\u00e9 non r\u00e9ticulable, d'un mat\u00e9riau pr\u00e9-r\u00e9ticul\u00e9 de type gel ou d'un syst\u00e8me polym\u00e9risable en place. La temp\u00e9rature, la thixotropie, la limite d'\u00e9lasticit\u00e9, la charge de remplissage et le stockage affectent son \u00e9talement. Un mat\u00e9riau froid peut n\u00e9cessiter plus de force pour mouiller une surface, tandis que le malaxage manuel d'une cartouche peut y incorporer de l'air.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Ne pas m\u00e9langer, chauffer ou d\u00e9gazer sous vide un mastic monocomposant fourni, sauf si sa fiche technique ou le fournisseur le permet. Le fournisseur a peut-\u00eatre d\u00e9j\u00e0 conditionn\u00e9 le mat\u00e9riau selon un proc\u00e9d\u00e9 contr\u00f4l\u00e9. Une correction bien intentionn\u00e9e en atelier peut an\u00e9antir ce travail.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Le syst\u00e8me d'alimentation peut ajouter de l'air avant le d\u00e9but de la distribution<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Le chargement des cartouches, le changement des seaux, les raccordements de tuyaux, la pulsation de la pompe et la pression d'alimentation ont tous de l'importance. Une bulle en amont peut parcourir plusieurs cycles avant d'atteindre la bus, faisant passer une cause reproductible pour al\u00e9atoire.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Les joints de remplissage hautement charg\u00e9s sont \u00e9galement abrasifs. DOPAG note que les mat\u00e9riaux thermoconducteurs peuvent contenir des charges telles que de l'oxyde d'aluminium et peuvent n\u00e9cessiter des composants de dosage r\u00e9sistants \u00e0 l'usure. Son aper\u00e7u de <a href=\"https:\/\/www.dopag.com\/applications\/application-cases\/dispensing-thermal-gap-fillers\/\" target=\"_blank\" rel=\"noopener\">dispensation de mat\u00e9riau de comblement d'entrefer thermique<\/a> est un rappel utile : l'\u00e9tat des pompes et des vannes rel\u00e8ve de la qualit\u00e9 thermique, et pas seulement de la maintenance des \u00e9quipements.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Pour un <a href=\"https:\/\/haktak.com\/fr\/liquid-gap-filler\/single-component-thermal-gel\/\">gel thermique monocomposant<\/a>, v\u00e9rifiez la mise en place de la cartouche, la pr\u00e9sence d'air pi\u00e9g\u00e9 pr\u00e8s du piston, la stabilit\u00e9 de la pression et les consignes de purge. Pour l'alimentation en vrac, ajoutez \u00e0 la liste l'\u00e9tanch\u00e9it\u00e9 de la plaque suiveuse, la proc\u00e9dure de changement de seau et la purge des tuyaux.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Les produits de rebouchage bicomposants ajoutent des risques de m\u00e9lange et de durcissement<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">En deux parties <a href=\"https:\/\/haktak.com\/fr\/liquid-gap-filler\/thermal-conductive-gap-fillers\/\">mat\u00e9riaux de remplissage de joints \u00e0 conductivit\u00e9 thermique<\/a> ajoutez le rapport A\/B, les conditions de m\u00e9lange, le mat\u00e9riau de red\u00e9marrage, la dur\u00e9e de vie en pot, la polym\u00e9risation et les contr\u00f4les de d\u00e9gagement gazeux. Si des bulles apparaissent uniquement apr\u00e8s la polym\u00e9risation, inspectez un \u00e9chantillon fra\u00eechement m\u00e9lang\u00e9 en dehors de l'assemblage. Cela permet de s\u00e9parer les d\u00e9fauts de chimie ou de m\u00e9lange de l'air emprisonn\u00e9 pendant la compression.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img decoding=\"async\" width=\"900\" height=\"506\" src=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-64.png\" alt=\"comment \u00e9viter les vides dans le mastic thermique\" class=\"wp-image-2206\" srcset=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-64.png 900w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-64-18x10.png 18w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-64-300x169.png 300w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-64-767x431.png 767w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-64-599x337.png 599w\" sizes=\"(max-width: 900px) 100vw, 900px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Commencer par le mat\u00e9riau et la pr\u00e9paration de la surface<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Avant de modifier le programme du robot, confirmez les bases. Fastidieux, oui, mais utile.<\/p>\n\n\n\n<ol start=\"1\" class=\"wp-block-list\">\n<li>V\u00e9rifier la qualit\u00e9, le lot, la dur\u00e9e de conservation, le stockage et le conditionnement approuv\u00e9.<\/li>\n\n\n\n<li>Inspecter pour d\u00e9tecter toute s\u00e9paration, des bougies s\u00e8ches ou un emballage endommag\u00e9.<\/li>\n\n\n\n<li>Nettoyez les deux surfaces d'accouplement selon une m\u00e9thode approuv\u00e9e.<\/li>\n\n\n\n<li>Mesurer le jeu minimal, nominal et maximal.<\/li>\n\n\n\n<li>V\u00e9rifier la plan\u00e9it\u00e9, la hauteur des composants, les nervures et les arr\u00eats m\u00e9caniques.<\/li>\n<\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">Ne supposez pas que l'intervalle CAO est l'intervalle de production. Le bombement du circuit imprim\u00e9, la variation de moulage, la tol\u00e9rance des composants et la compression des vis peuvent le modifier. La poussi\u00e8re peut maintenir les surfaces \u00e9cart\u00e9es, tandis que l'huile peut donner un aspect de contact humide mais instable. Le nettoyage doit \u00eatre adapt\u00e9 au mastic et au substrat.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"900\" height=\"506\" src=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-65.png\" alt=\"comment \u00e9viter les vides dans le mastic thermique\" class=\"wp-image-2207\" srcset=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-65.png 900w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-65-18x10.png 18w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-65-300x169.png 300w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-65-599x337.png 599w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-65-767x431.png 767w\" sizes=\"(max-width: 900px) 100vw, 900px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Choisissez un mode de distribution qui permet \u00e0 l'air de s'\u00e9chapper<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Il n'y a pas de motif magique. La forme de d\u00e9part d\u00e9pend de l'empreinte, de la rh\u00e9ologie, de l'entrefer, de la topographie, de la direction de fermeture et de la compression. Pensez \u00e0 du dentifrice sous une plaque transparente : une ligne courte peut s'\u00e9taler vers l'ext\u00e9rieur, tandis qu'un anneau ferm\u00e9 peut emprisonner de l'air au milieu. Le mastic n'est pas tout \u00e0 fait du dentifrice, mais l'id\u00e9e de la voie d'\u00e9chappement fonctionne.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td class=\"has-text-align-left\" data-align=\"left\">G\u00e9om\u00e9trie de l'interface<\/td><td class=\"has-text-align-left\" data-align=\"left\">Mod\u00e8le de d\u00e9part utile<\/td><td class=\"has-text-align-left\" data-align=\"left\">Risque principal<\/td><td class=\"has-text-align-left\" data-align=\"left\">M\u00e9thode de validation<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Petit colis plat<\/td><td class=\"has-text-align-left\" data-align=\"left\">Point central ou trait court<\/td><td class=\"has-text-align-left\" data-align=\"left\">Sous-couverture dans les angles<\/td><td class=\"has-text-align-left\" data-align=\"left\">Effacer le coupon ou transf\u00e9rer la construction<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Zone rectangulaire longue<\/td><td class=\"has-text-align-left\" data-align=\"left\">Longs cordons ou cordons parall\u00e8les espac\u00e9s<\/td><td class=\"has-text-align-left\" data-align=\"left\">Air emprisonn\u00e9 entre des perles en fusion<\/td><td class=\"has-text-align-left\" data-align=\"left\">Construction de t\u00e9moin sectionn\u00e9 et test thermique<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Composants de hauteurs diff\u00e9rentes<\/td><td class=\"has-text-align-left\" data-align=\"left\">Points cibl\u00e9s ou courts cordons par zone de hauteur<\/td><td class=\"has-text-align-left\" data-align=\"left\">Les composants faibles restent intacts<\/td><td class=\"has-text-align-left\" data-align=\"left\">Transf\u00e9rer des rep\u00e8res au-del\u00e0 des tol\u00e9rances extr\u00eames<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Grande plaque froide ou canal de batterie<\/td><td class=\"has-text-align-left\" data-align=\"left\">Billes parall\u00e8les contr\u00f4l\u00e9es ou serpentin ouvert<\/td><td class=\"has-text-align-left\" data-align=\"left\">Cordon irr\u00e9gulier, fusion in\u00e9gale, longue distance d'\u00e9coulement<\/td><td class=\"has-text-align-left\" data-align=\"left\">Scan 3D de billes et premier article destructif<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\">Petites interfaces plates<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Un point central ou une ligne courte peut permettre \u00e0 la mati\u00e8re de se d\u00e9placer vers l'ext\u00e9rieur \u00e0 mesure que l'air s'\u00e9chappe sur le p\u00e9rim\u00e8tre. Validez la couverture des coins et l'\u00e9paisseur aux jeux minimum et maximum.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Interfaces longues ou rectangulaires<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Un long cordon, un serpentin ouvert ou des cordons parall\u00e8les peuvent raccourcir la distance d'\u00e9coulement. \u00c9vitez les boucles ferm\u00e9es, sauf si des tests prouvent que le centre peut s'\u00e9venter. Inspectez \u00e9galement la soudure l\u00e0 o\u00f9 les cordons parall\u00e8les fusionnent.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Champs de composants de hauteurs mixtes<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Cartographiez les sources de chaleur et les zones de hauteur sur la VRAM, le VRM, les bobines d'inductance et les contr\u00f4leurs. Atteignez les points bas sans exercer de force excessive sur les composants hauts d\u00e9licats.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Grandes surfaces de batterie et de plaque froide<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Les astuces de p\u00e2te thermique pour processeur ne s'appliquent pas directement \u00e0 un module de batterie. Contr\u00f4lez l'espacement des cordons, la vitesse du robot, les virages dans les coins, les d\u00e9marrages, les arr\u00eats et le sens de fermeture. Utilisez la vision 3D et des fabrications de t\u00e9moins p\u00e9riodiques, pas un seul beau cordon.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Contr\u00f4ler l'ensemble du processus de distribution et de fermeture<\/h2>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"900\" height=\"506\" src=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-66.png\" alt=\"comment \u00e9viter les vides dans le mastic thermique\" class=\"wp-image-2208\" srcset=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-66.png 900w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-66-300x169.png 300w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-66-18x10.png 18w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-66-599x337.png 599w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-66-767x431.png 767w\" sizes=\"(max-width: 900px) 100vw, 900px\" \/><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\">Stabiliser la g\u00e9om\u00e9trie de l'alimentation et du cordon<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Purges de d\u00e9marrage et de changement de seau de documents. Surveiller la pression d'alimentation, inspecter l'usure de la buse et r\u00e9gler le reflux sans aspirer d'air dans l'embout. V\u00e9rifier le poids de la injection ou le volume mesur\u00e9 ainsi que l'emplacement, la largeur, la hauteur et la continuit\u00e9 du cordon. La quantit\u00e9 ne peut pas prouver le placement, tandis qu'une cam\u00e9ra peut manquer un cordon bas. Utilisez les deux.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Close the Assembly the Same Way Every Time<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">The top part should meet the deposit along a controlled path. A tilted heat sink can seal one edge first; lateral sliding may scrape material away. Use alignment features, defined speed and dwell, and a validated screw sequence. Where possible, tighten in small cross-pattern steps.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Record material lot, package time, recipe, shot, closure, torque, alarms, and maintenance. When a field unit runs hot six months later, \u201cthe bead looked fine\u201d is not much of a record.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"900\" height=\"506\" src=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-67.png\" alt=\"comment \u00e9viter les vides dans le mastic thermique\" class=\"wp-image-2209\" srcset=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-67.png 900w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-67-18x10.png 18w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-67-300x169.png 300w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-67-599x337.png 599w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-67-767x431.png 767w\" sizes=\"(max-width: 900px) 100vw, 900px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Does More Thermal Putty Reduce Voids?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Not by itself. Underfill can leave obvious missed areas. Correct fill covers the target at the validated final gap. Overfill may create excessive squeeze-out, raise assembly force, contaminate connectors, or hold another interface open.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Estimate volume from footprint area and expected gap, then adjust for surface features and validated squeeze-out. Physical trials are still required. Actual <a href=\"https:\/\/haktak.com\/fr\/how-bond-line-thickness-affects-thermal-performance\/\">\u00e9paisseur des liaisons<\/a> is controlled by the assembly, not the syringe label.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">More conductive filler or a higher advertised W\/m\u00b7K value does not automatically rescue poor coverage either. The article on <a href=\"https:\/\/haktak.com\/fr\/why-high-wmk-does-not-always-mean-better-cooling-performance\/\">why high W\/m\u00b7K does not always mean better cooling<\/a> explains the practical reason: interface thickness, wet-out, contact resistance, and assembly conditions all join the party.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">How to Detect Voids Before and After Assembly<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">No single inspection method sees everything. Use a layered plan.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td class=\"has-text-align-left\" data-align=\"left\">M\u00e9thode<\/td><td class=\"has-text-align-left\" data-align=\"left\">What it can show<\/td><td class=\"has-text-align-left\" data-align=\"left\">Main limitation<\/td><td class=\"has-text-align-left\" data-align=\"left\">Meilleure utilisation<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">2D vision<\/td><td class=\"has-text-align-left\" data-align=\"left\">Bead position, width, breaks, gross contamination<\/td><td class=\"has-text-align-left\" data-align=\"left\">Little height or hidden-interface information<\/td><td class=\"has-text-align-left\" data-align=\"left\">Routine pre-assembly screening<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">3D vision or laser profile<\/td><td class=\"has-text-align-left\" data-align=\"left\">Bead height, shape, estimated volume<\/td><td class=\"has-text-align-left\" data-align=\"left\">Cannot prove the compressed contact area<\/td><td class=\"has-text-align-left\" data-align=\"left\">Automated process control<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Shot weight or flow monitoring<\/td><td class=\"has-text-align-left\" data-align=\"left\">Missing shot and gradual quantity drift<\/td><td class=\"has-text-align-left\" data-align=\"left\">Cannot prove correct location or spreading<\/td><td class=\"has-text-align-left\" data-align=\"left\">Every-cycle monitoring<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Witness or transfer build<\/td><td class=\"has-text-align-left\" data-align=\"left\">Real spread and contact pattern<\/td><td class=\"has-text-align-left\" data-align=\"left\">Destructive and slower<\/td><td class=\"has-text-align-left\" data-align=\"left\">Development, first article, change validation<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">X-ray or CT<\/td><td class=\"has-text-align-left\" data-align=\"left\">Internal features where contrast and geometry allow<\/td><td class=\"has-text-align-left\" data-align=\"left\">Cost, cycle time, resolution, material contrast<\/td><td class=\"has-text-align-left\" data-align=\"left\">Failure analysis and high-risk samples<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Thermal test or IR image<\/td><td class=\"has-text-align-left\" data-align=\"left\">Hot spots and poor overall heat transfer<\/td><td class=\"has-text-align-left\" data-align=\"left\">Does not identify the unique root cause<\/td><td class=\"has-text-align-left\" data-align=\"left\">Device validation and diagnosis<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">A sound plan combines pre-assembly vision, a destructive transfer study, and a thermal test. Add X-ray, CT, or a suitable acoustic method for high-risk parts when material and geometry permit.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"900\" height=\"506\" src=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-68.png\" alt=\"comment \u00e9viter les vides dans le mastic thermique\" class=\"wp-image-2210\" srcset=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-68.png 900w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-68-300x169.png 300w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-68-18x10.png 18w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-68-767x431.png 767w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-68-599x337.png 599w\" sizes=\"(max-width: 900px) 100vw, 900px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Troubleshoot the Shape of the Void, Not Just Its Presence<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td class=\"has-text-align-left\" data-align=\"left\">Observed defect<\/td><td class=\"has-text-align-left\" data-align=\"left\">Likely cause<\/td><td class=\"has-text-align-left\" data-align=\"left\">Evidence to collect<\/td><td class=\"has-text-align-left\" data-align=\"left\">Orientation corrective<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Repeated center void<\/td><td class=\"has-text-align-left\" data-align=\"left\">Closed pattern or perimeter sealing too early<\/td><td class=\"has-text-align-left\" data-align=\"left\">Transfer image and closure video<\/td><td class=\"has-text-align-left\" data-align=\"left\">Open an escape path; revise pattern or closure direction<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Edge starvation<\/td><td class=\"has-text-align-left\" data-align=\"left\">Too little volume, long flow path, lateral slide<\/td><td class=\"has-text-align-left\" data-align=\"left\">Bead dimensions and squeeze-out map<\/td><td class=\"has-text-align-left\" data-align=\"left\">Adjust volume, bead location, or alignment<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Random bubbles after cure<\/td><td class=\"has-text-align-left\" data-align=\"left\">Air in supply, poor mixing, or outgassing<\/td><td class=\"has-text-align-left\" data-align=\"left\">Purged sample, ratio record, cured cup sample<\/td><td class=\"has-text-align-left\" data-align=\"left\">Fix loading, meter\/mixer, pause rule, or cure condition<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Missing material at starts or stops<\/td><td class=\"has-text-align-left\" data-align=\"left\">Poor trigger timing, suck-back, stringing<\/td><td class=\"has-text-align-left\" data-align=\"left\">Robot trace and close-up vision<\/td><td class=\"has-text-align-left\" data-align=\"left\">Tune lead-in, lead-out, tip height, and dispense command<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">One low component has no contact<\/td><td class=\"has-text-align-left\" data-align=\"left\">Height tolerance or misplaced deposit<\/td><td class=\"has-text-align-left\" data-align=\"left\">Height map and transfer print<\/td><td class=\"has-text-align-left\" data-align=\"left\">Zone the pattern or select a more conformable grade<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Voids grow after thermal cycling<\/td><td class=\"has-text-align-left\" data-align=\"left\">Pump-out, slump, expansion mismatch<\/td><td class=\"has-text-align-left\" data-align=\"left\">Before\/after scan and thermal history<\/td><td class=\"has-text-align-left\" data-align=\"left\">Review rheology, gap, retention, and cycling requirement<\/td><\/tr><tr><td class=\"has-text-align-left\" data-align=\"left\">Heavy edge squeeze-out but poor center contact<\/td><td class=\"has-text-align-left\" data-align=\"left\">Enclosure bow, hard stop, central obstruction<\/td><td class=\"has-text-align-left\" data-align=\"left\">Flatness scan and final-gap measurement<\/td><td class=\"has-text-align-left\" data-align=\"left\">Correct mechanics before adding material<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">This table is a starting point, not a verdict. Change one controlled variable at a time. If pattern, pressure, material, and torque all change together, a good result teaches you almost nothing.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"900\" height=\"506\" src=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-69.png\" alt=\"comment \u00e9viter les vides dans le mastic thermique\" class=\"wp-image-2211\" srcset=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-69.png 900w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-69-18x10.png 18w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-69-300x169.png 300w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-69-767x431.png 767w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-69-599x337.png 599w\" sizes=\"(max-width: 900px) 100vw, 900px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Different Applications, Different Priorities<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">For a GPU or laptop cooler, watch direct-die contact, tilt, and VRAM\/VRM height. Telecom radios and servers add vertical orientation and repeated power cycling. EV batteries and inverters bring large areas, dielectric concerns, vibration, and traceability. LED and industrial products often bring cast-housing flatness and outdoor temperature swings. The root principles travel; the process window does not.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Standards and Test Methods: What They Prove<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">The current active edition, ASTM D5470-17(2024), measures steady-state thermal impedance under controlled conditions. Its material categories include viscous liquids such as grease and paste, plus viscoelastic solids such as gels. That makes <a href=\"https:\/\/store.astm.org\/d5470-17r24.html\" target=\"_blank\" rel=\"noopener\">ASTM D5470<\/a> useful for material characterization, but it is not a universal void-acceptance rule for a finished GPU, battery pack, or telecom enclosure.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">IEC 60068 environmental methods can support temperature, damp-heat, vibration, and related reliability plans when the relevant parts fit the product. IPC workmanship or quality frameworks may also apply through a customer specification. For a broader overview, see these <a href=\"https:\/\/haktak.com\/fr\/common-tim-testing-standards-engineers-should-know\/\">normes communes de test TIM<\/a>.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The drawing, work instruction, supplier TDS and SDS, and device-level requirement still do the daily work. Define:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Maximum void area and individual void size<\/li>\n\n\n\n<li>Critical no-void zones over hot components<\/li>\n\n\n\n<li>Required coverage and squeeze-out limits<\/li>\n\n\n\n<li>Final gap or interface thickness<\/li>\n\n\n\n<li>Thermal performance at beginning and end of life<\/li>\n\n\n\n<li>Inspection method, sampling rate, and reaction plan<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">There is no honest universal answer such as \u201c5% is always safe.\u201d Location, heat flux, geometry, voltage isolation, and failure consequence change the decision.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"900\" height=\"506\" src=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-70.png\" alt=\"comment \u00e9viter les vides dans le mastic thermique\" class=\"wp-image-2212\" srcset=\"https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-70.png 900w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-70-18x10.png 18w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-70-300x169.png 300w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-70-767x431.png 767w, https:\/\/haktak.com\/wp-content\/uploads\/2026\/09\/image-70-599x337.png 599w\" sizes=\"(max-width: 900px) 100vw, 900px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">What to Send Your Material or Dispensing Supplier<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">If voids keep returning, send more than one blurry photo. Include the interface drawing, height map, gap range, keep-out zones, bead pattern, cycle time, and closure direction. Add the material lot, storage, conditioning, pump, hose, nozzle, pressure, speed, mixer, purge method, screw sequence, inspection result, and thermal target.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">That package gives a supplier something solid to work with. Haktak can use the same inputs for <a href=\"https:\/\/haktak.com\/fr\/material-selection-testing\/\">support pour la s\u00e9lection des mat\u00e9riaux et les essais<\/a> when a standard grade or current process does not fit the real tolerance stack.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Conclusion<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Avoiding voids in thermal putty is not about finding one clever dispense pattern or adding a larger blob. It is a system problem.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Start with stable material and clean surfaces. Give air an open route. Control bead geometry, closure, gap, and screw sequence. A camera can approve the bead; post-assembly evidence shows how the interface ended up.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">That approach may feel less exciting than changing a robot path in five minutes. It is also far more likely to keep the hot spot from coming back.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Foire aux questions<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">What causes voids in thermal putty?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Common causes include air in the material supply, an unsuitable dispense pattern, insufficient or excessive volume, unstable bead geometry, surface contamination, assembly tilt, lateral sliding, and poor control of two-part mixing or cure.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Do air bubbles reduce thermal putty performance?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">They can. Air interrupts the intended conductive path and may increase interface resistance. The effect depends on bubble size, depth, location, heat flux, and the rest of the cooling design.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">What is the best application pattern for thermal putty?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">There is no universal best pattern. A dot or short line may suit a small flat interface. Long areas may need an open serpentine or spaced beads. Validate the pattern across real gap and flatness tolerances.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Should thermal putty be spread by hand before assembly?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Only if the supplier and work instruction allow it. Manual spreading may introduce contamination, uneven thickness, or trapped folds. A controlled deposit followed by repeatable compression is usually easier to monitor.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Can applying more thermal putty remove air gaps?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Sometimes underfill needs correction, but extra material is not a general void fix. Overfill can raise force, create squeeze-out, contaminate nearby parts, and distort the final interface.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Should one-part thermal putty be vacuum degassed?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Not unless the material supplier specifically approves the method. Packaged one-part putty may already be processed to limit air. Uncontrolled degassing can change composition, rheology, or handling.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">How are hidden voids detected after a heat sink is installed?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Options include destructive transfer builds, X-ray or CT where contrast allows, suitable acoustic methods, and device-level thermal testing. The best choice depends on material, geometry, risk, and production volume.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Are voids more common in two-part thermal gap fillers?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Not necessarily, but two-part materials have extra failure paths. Ratio error, poor mixing, expired pot life, air during pail changes, and cure outgassing must be controlled along with placement and closure.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Can voided thermal putty be topped up or reworked?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Do not simply top up by default. Remove and replace the deposit when the material, contamination risk, or work instruction requires it. If rework is allowed, define cleaning, refill volume, inspection, and retest steps.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">What void percentage is acceptable in a thermal interface?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">There is no universal percentage. The product team should set limits for total area, individual size, location over critical heat sources, thermal performance, electrical risk, and end-of-life reliability.<\/p>\n<\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>Applying thermal putty is a little like packing a suitcase. If air has nowhere to go, pushing harder on the [&hellip;]<\/p>\n","protected":false},"author":4,"featured_media":2208,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"disabled","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[1],"tags":[],"class_list":["post-2202","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-haktak-blog"],"_links":{"self":[{"href":"https:\/\/haktak.com\/fr\/wp-json\/wp\/v2\/posts\/2202","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/haktak.com\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/haktak.com\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/haktak.com\/fr\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/haktak.com\/fr\/wp-json\/wp\/v2\/comments?post=2202"}],"version-history":[{"count":2,"href":"https:\/\/haktak.com\/fr\/wp-json\/wp\/v2\/posts\/2202\/revisions"}],"predecessor-version":[{"id":2213,"href":"https:\/\/haktak.com\/fr\/wp-json\/wp\/v2\/posts\/2202\/revisions\/2213"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/haktak.com\/fr\/wp-json\/wp\/v2\/media\/2208"}],"wp:attachment":[{"href":"https:\/\/haktak.com\/fr\/wp-json\/wp\/v2\/media?parent=2202"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/haktak.com\/fr\/wp-json\/wp\/v2\/categories?post=2202"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/haktak.com\/fr\/wp-json\/wp\/v2\/tags?post=2202"}],"curies":[{"name":"Bien jou\u00e9","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}