Showing 21–38 of 38 results

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  Acrylate

  PW 1490E-2 Electrically Insulating Potting Compound for Electronics

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  Acrylate

  PW 1490MC Engineered for Flexible Application: A Versatile, Moisture-Resistant UV Cure for PC Bonding

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  Acrylate

  PW 1504F Fast-Curing Potting Compound for Electronic Assemblies

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  Acrylate

  PW 1504H-2 High-Hardness Encapsulation Resin for Mechanical Protection

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  Acrylate

  PW 1506F Flowable Potting Compound for Complex Electronic Structures

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  Acrylate

  PW 1516HF High-Reliability Encapsulation Material for Electronic Modules

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  Acrylate

  PW 1516NF High-Reliability Encapsulation Material for Electronic Modules

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  Acrylate

  PW 1516NF-2 High-Reliability Encapsulation Material for Electronic Modules

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  Acrylate

  PW 1518M Modified Potting Compound for Improved Thermal Stability

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  Acrylate

  PW 1518M2 Modified Potting Compound for Improved Thermal Stability

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  Acrylate

  PW 2440HR(HQ) IBOA-Free Dual-Cure Adhesive for Sealing, Potting, and Bonding

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  Acrylate

  PW 2440LR Elastic Cure for Complete Coverage: A Flexible Sealant with UV/Moisture Dual Activation

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  Acrylate

  PW 2440NR(HQ) Multi-Functional Dual-Cure Adhesive for Sealing, Potting, and Bonding

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  Acrylate

  PW 2440NR(PO) Triple-Protection for PCBs: Seal, Pot, and Bond with One Flexible, Dual-Cure Formula

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  Acrylate

  PW 2452-1 Epoxy Potting Compound – Electrical Insulation & Environmental Protection for Electronics

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  Acrylate

  PW 2460N IBOA-Free, Dual-Cure (UV/Moisture) Adhesive for Sealing & Component Protection

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  Acrylate

  PW 2466E Guaranteed Full Cure: A Versatile and IBOA-Free Encapsulant for Electronics Protection

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  Acrylate

  PW 2466R Sealing and Bonding Solutions for PCBs: UV & Moisture Dual-Cure Technology

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