Showing 1–20 of 38 results

• 
  Acrylate

  AW 2901 Structural Acrylic Adhesive – Fast Fixture, High Strength

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  Acrylate

  AW 2902 Structural Acrylic Adhesive – Fast Fixture, High Strength

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  Acrylate

  AW 2903 Structural Acrylic Adhesive – Fast Fixture, High Strength

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• 
  Acrylate

  AW 2922 Two-Component Acrylic Structural Adhesive – Metal & Composite Bonding

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• 
  Acrylate

  AW 2922M Two-Component Acrylic Structural Adhesive – Metal & Composite Bonding

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• 
  Acrylate

  AW 2928 Two-Component Acrylic Structural Adhesive – Metal & Composite Bonding

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  Acrylate

  AW 2928MT Two-Component Acrylic Structural Adhesive – Metal & Composite Bonding

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• 
  Acrylate

  CT 2290 Two-Component Acrylic Structural Adhesive – Metal & Composite Bonding

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• 
  Acrylate

  CT 2295 Low-Stress Underfill Adhesive for Fine-Pitch Packages

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• 
  Acrylate

  CT 6010 High-Reliability Underfill for Advanced Semiconductor Packaging

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  Acrylate

  CT 6020 General-Purpose Underfill for Electronic Assemblies

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• 
  Acrylate

  CT 6020H High-Tg Underfill for Thermal Cycling Resistance

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• 
  Acrylate

  CT 6020HV Thermal-Curing Potting Compound for FPC & Component Encapsulation

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• 
  Acrylate

  PW 1422 The Reliable Seal for Screws: UV & Thermal Dual-Curing Formula

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  Acrylate

  PW 1462 General-Purpose Encapsulation Materials for Electronics Protection

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• 
  Acrylate

  PW 1488 Acrylate Hybrid Adhesive – UV & Thermal Dual Curing for Sealing, Potting and Bonding on PCB/FPCB

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• 
  Acrylate

  PW 1488 KT One-Part Acrylate Hybrid Adhesive – UV & Thermal Dual Curing for Sealing, Potting and PCB/FPCB Protection

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• 
  Acrylate

  PW 1488M One-Part Acrylate Hybrid Adhesive – UV & Thermal Dual Curing for Sealing, Potting and PCB/FPCB Protection

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• 
  Acrylate

  PW 1490C Encapsulation Resin for Electronic Component Protection

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• 
  Acrylate

  PW 1490D Encapsulation Resin for Electronic Component Protection

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