Engineered Material Portfolio
Thermal Interface Materials and Electronic Adhesives
Select materials for heat transfer, precision bonding, sealing, encapsulation, surface protection and semiconductor assembly. Haktak supports engineers from the first material screen through samples, process trials and production-scale supply.
Quick Engineering Selector
Compare Thermal Interface Materials and Electronic Adhesives
Start with the physical interface and production method. Final approval should use representative substrates, geometry, cure and environmental exposure.
Review RFQ inputs| Famille de matériaux | Best starting point when | Key variables | Review before approval |
|---|---|---|---|
| Pad thermique | Clean placement, gap accommodation and possible electrical isolation are required. | Gap, compression, hardness, thickness and clamp force. | Contact area, component load and dielectric integrity. |
| Matériau de remplissage liquide | Surfaces are irregular, gaps vary or broad-area stress must remain low. | Mix, deposit mass, spread, cure and containment. | Voids, overflow, settling and assembly delay. |
| Pâte thermique | A flat, clamped and serviceable interface can maintain a thin bond line. | Volume, coverage, bond-line thickness and preload. | Pump-out, migration, contamination and aging. |
| Phase change material | Dry placement and a repeatable thin interface are preferred. | Activation temperature, pressure and surface condition. | Wetting, edge flow and reassembly behavior. |
| Adhésif thermique | The joint must permanently bond components and transfer heat. | Chemistry, cure, bond line, modulus and preparation. | CTE stress, trapped air, adhesion and rework. |
| Electronic adhesive | The assembly needs bonding, sealing, potting, coating or underfill. | Substrates, viscosity, cure access and flexibility. | Shadow cure, shrinkage, cleanliness and aging. |
Compare candidates at the actual gap and pressure. Bulk thermal conductivity alone does not predict final assembly performance.
Priority Applications
Thermal Management Materials for High-Reliability Electronics
Screen each material against the assembled heat path, mechanical stack and manufacturing process.
Battery Modules and Cold Plates
Manage broad interfaces, gap tolerance, dispensing repeatability, vibration and thermal cycling.
Explore EV battery materials
Interfaces GPU, HBM et plaques froides
Control thin interfaces, flatness, preload, hot spots, pump-out and serviceability.
Review AI server solutions
IGBT, MOSFET and Inverter Assemblies
Balance heat transfer, dielectric control, clamp load, power cycling and CTE movement.
View power electronics materials
Package, PCB and Precision Assembly
Control flow, cure stress, electrical behavior, cleanliness and process traceability.
Explorer l'assemblage des semi-conducteursEngineering Support
Move from Material Screening to Production
Use focused support when the standard product list does not fully answer a geometry, process or reliability requirement.
Engineering RFQ
Get a Material Recommendation
Share the information you already have. Haktak application engineering can use it to narrow the product family and recommend the most useful next test.
Foire aux questions
Thermal Interface Materials and Electronic Adhesives FAQ
Which thermal interface material should I start with?
Start with the gap and assembly method. Choose a pad for clean preformed placement, a liquid gap filler for irregular gaps, grease for a thin clamped and serviceable interface, a phase change material for dry placement and in-service wetting, or a thermal adhesive when permanent bonding is also required.
Is the highest thermal conductivity always the best choice?
No. Final performance also depends on bond-line thickness, pressure, wetting, flatness, contact resistance, voids and aging. Compare thermal resistance at the actual joint conditions.
When should I choose a thermal pad instead of liquid gap filler?
A pad suits clean handling, controlled thickness and die-cut placement. A liquid gap filler is stronger when gaps vary, surfaces are complex or pad compression would create excessive component stress.
When is a thermally conductive adhesive appropriate?
Use one when the same joint must transfer heat and provide durable fixation. Validate cure, bond-line control, surface preparation, CTE stress and electrical behavior.
What information is needed to request a sample?
Share the heat path, gap, bond area, substrates, electrical requirement, operating environment, mechanical loads, dispensing preference, cure capability, sample quantity and annual volume.