Hiển thị 1–20 của 38 kết quả

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  Acrylat

  AW 2901 Structural Acrylic Adhesive – Fast Fixture, High Strength

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  Acrylat

  AW 2902 Structural Acrylic Adhesive – Fast Fixture, High Strength

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  Acrylat

  Keo dán cấu trúc Acrylic AW 2903 – Định vị nhanh, cường độ cao

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• 
  Acrylat

  Keo kết cấu acrylic hai thành phần AW 2922 – Dán kim loại & vật liệu composite

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  Acrylat

  AW 2922M Two-Component Acrylic Structural Adhesive – Metal & Composite Bonding

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  Acrylat

  AW 2928 Two-Component Acrylic Structural Adhesive – Metal & Composite Bonding

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• 
  Acrylat

  Keo dán kết cấu acrylic hai thành phần AW 2928MT – Dán kim loại & vật liệu tổng hợp

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  Acrylat

  CT 2290 Two-Component Acrylic Structural Adhesive – Metal & Composite Bonding

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  Acrylat

  CT 2295 Low-Stress Underfill Adhesive for Fine-Pitch Packages

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  Acrylat

  CT 6010 High-Reliability Underfill for Advanced Semiconductor Packaging

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  Acrylat

  CT 6020 General-Purpose Underfill for Electronic Assemblies

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  Acrylat

  CT 6020H High-Tg Underfill for Thermal Cycling Resistance

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• 
  Acrylat

  Hợp chất đổ khuôn đóng rắn bằng nhiệt CT 6020HV dùng cho FPC và đóng gói linh kiện

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  Acrylat

  PW 1422 The Reliable Seal for Screws: UV & Thermal Dual-Curing Formula

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  Acrylat

  PW 1462 General-Purpose Encapsulation Materials for Electronics Protection

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  Acrylat

  PW 1488 Acrylate Hybrid Adhesive – UV & Thermal Dual Curing for Sealing, Potting and Bonding on PCB/FPCB

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• 
  Acrylat

  Keo lai Acrylate một thành phần PW 1488 KT – Đóng rắn kép bằng tia UV và nhiệt dùng để bịt kín, đổ keo và bảo vệ PCB/FPCB

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  Acrylat

  PW 1488M One-Part Acrylate Hybrid Adhesive – UV & Thermal Dual Curing for Sealing, Potting and PCB/FPCB Protection

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  Acrylat

  PW 1490C Encapsulation Resin for Electronic Component Protection

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  Acrylat

  PW 1490D Encapsulation Resin for Electronic Component Protection

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