N-Sil 8608D High-Temperature Resistant Thermally Conductive Silicone Potting

Category:

Key Features

• Thixotropic with good controlled flowability

• High SIR

• Tack free

Data Specificiation

Application

Sealing / Encapsulation, Thermally Conductive

Chemical Type

Silicone

Appearance

White paste

Minimum Application Thickness

35 μm

Penetration (1/10 mm)

300-350

Curing Method

UV / Light Curing

Curing Time

/

Hardness (Shore A)

50/ ASTM D2240

Tensile Strength (MPa)

未找到

Elongation at Break (%)

未找到

Operating Temperature (°C)

-50 to 200

Minimum Thawing Temperature (°C)

未找到

Thermal Conductivity (W/m·K)

0.8

Volume Resistivity (Ω.cm)

>2.0×10¹³

Dielectric Strength

≥6.0

Specific Gravity @25°C

2.35

Production Description​

Directions for Use

Thawing

* When the storage temperature of the material differs from the environmental temperature by 15° or more, the material needs to be thawed.

1. Do not open the container before the adhesive reaches 25°C. Any moisture condensation the container during defrosting should be removed before opening.

2. Once the adhesive has reached room temperature, it should not be re-refrigerated. Voids can form in syringes if it is refrigerated repeatedly.

Surface Treatment

1. Surface to be bonded should be free of dust, oil, grease or any other contaminants. For slightly contaminated surfaces, it is sufficient to wipe with isopropanol or ethanol.

2. Substrates with a low surface energy (e.g. polyethylene, polypropylene, Teflon) need to be pre- treated physically (e.g. atmospheric plasma or corona) in order

to achieve sufficient adhesion.

Dispensing and Curing

1. Products are supplied ready for use. Depending on package type, they can be dispensed manually, semi- automatically or fully-automatically with a dispensing equipment. With automatic dispensing using a cartridge, the adhesive is conveyed via pressure and a piston rod to a dispense valve. For bottles, the adhesive is conveyed using a pump.

2. A variety of valves are available to adjust for the desired dispensing accuracy and speed.

3. After application, it is recommended that the two substrate be adjoined immediately as it is possible the curing process will begin with select products under ambient conditions.

4. The actual curing performance may vary depending on the UV lamp setting of the curing equipment, size and shape of parts, loading of samples, ambient conditions, etc.

Note: Please consult our Application Engineering dept. for further recommendations.

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